Methods and apparatus for fiber-optic modules with shielded housing/covers having a front portion and a back portion

ABSTRACT

A fiber-optic module having a housing/shielding unit and a module chassis frame having optical, electrical and electro-optical components. The housing/shielding unit functions both as a protective outer housing and an electromagnetic shield. The housing/shielding unit includes forward fingers and backward fingers. The forward fingers provide an EMI seal around an opening in a bezel, face-plate, back-plate, wall, or panel of a host system and thereby can ground the housing/shielding unit to a chassis ground. The backward fingers can contact host tabs of the host system and can also thereby ground the housing/shielding unit to a chassis ground. The module chassis frame may be formed of a conductive material and can be grounded as well through a host system faceplate or otherwise to the chassis ground.

CROSS REFERENCE TO RELATED APPLICATIONS

[0001] This United States non-provisional patent application claims thebenefit and is a divisional application of U.S. patent application Ser.No. 09/934,875, filed Aug. 22, 2001 by Dair et al., now allowed, whichclaims the benefit and is a continuation-in-part of U.S. patentapplication Ser. No. 09/782,875, filed on Feb. 12, 2001 by Dair et al.,pending, all of which are to be assigned to E2O Communications, Inc.

FIELD OF THE INVENTION

[0002] The invention relates to electromagnetic shielding, and morespecifically, to electromagnetic shielding of fiber-optic modules.

BACKGROUND OF THE INVENTION

[0003] As the need for greater data bandwidth over networks has explodedover the past few years, there has been a move towards using opticalfibers as a transmission medium. Today, optical fiber made of dielectricmaterials are routinely used in communication channels from large publictransmission media to Local Area Networks transmitting information fromone node to another. The main difference between a fiber-opticcommunication system and other types of communication systems is thatsignals are transmitted as light or photons over optical fibers. Opticalfiber or fiber-optic cables enable high speed communication of signalsby guiding light or photons therein. At each end of a fiber-optic cablea transducer may be found that converts a light, photon or opticalsignal into an electrical signal; an electrical signal into a light,photon or optical signal; or a pair of transducers may do both. At atransmission end, an electrical-to-optical converter (EO) convertselectrical signals into light or optical signals. At a receiving end, anoptical-to-electrical converter (OE) converts a light, photon or opticalsignal into an electrical signal. In nodes of a communication system, itmay be desirable to both transmit and receive light or optical signalsat a node. In which case an optical-to-electrical converter (OE, i.e.receiver) and an electrical-to-optical converter (EO, i.e. transmitter)may be included to receive and transmit optical or light signalsrespectively. Therefore, the optical-to-electrical converter (OE, i.e.receiver) and the electrical-to-optical converter (EO, i.e. transmitter)are oftentimes physically located together as a single module referredto as an electro-optic, opto-electronic or fiber-optic transceiver.Fiber-optic transceivers, including fiber-optic transmitters andfiber-optic receivers, can also be referred to as fiber-optic modules.

[0004] Because of the high frequency needed in some of the electronicsand the electro-optic components, such as the optical-to-electricalconverter (OE, i.e. receiver) and electrical-to-optical converter (EO,i.e. transmitter), electromagnetic radiation can be generated which caninterfere with other communication systems. This electromagneticradiation is oftentimes referred to as electromagnetic interference(EMI). Electromagnetic radiation radiating externally out from afiber-optic module or a system that incorporates the fiber-optic moduleis of great concern. To reduce electromagnetic radiation from radiatingout of fiber-optic modules and systems with fiber optic modules as EMI,external electromagnetic shielding of internal electronic andopto-electronic components is often utilized. The externalelectromagnetic shielding can additionally reduce effects of externalelectromagnetic radiation on the internal components of a fiber-opticmodule and the system.

BRIEF DESCRIPTION OF THE DRAWINGS

[0005]FIG. 1 is a rear isometric view of the fiber-optic moduleaccording to a first embodiment of the invention

[0006]FIG. 2 is a front isometric view of the fiber-optic moduleaccording to the first embodiment of the invention

[0007]FIG. 3 is a rear isometric view of a housing/shielding unitaccording to the first embodiment of the invention.

[0008]FIG. 4A is a bottom rear isometric view of the housing/shieldingunit according to the first embodiment of the invention.

[0009]FIG. 4B is a bottom rear isometric view of an alternatehousing/shielding unit according to an alternate embodiment of theinvention.

[0010]FIG. 5A is an isometric view of a module chassis frame and ahousing/shielding unit according to the first embodiment of theinvention.

[0011]FIG. 5B is an isometric view of a module chassis frame and ahousing/shielding unit according to an alternate embodiment of theinvention.

[0012]FIG. 6 is an exploded view of the fiber-optic module with thehousing/shielding unit and the module chassis frame according to thefirst embodiment of the invention.

[0013]FIG. 7 is an isometric view of a module chassis frame and ahousing/shielding unit for an fiber-optic module according to a secondembodiment of the invention.

[0014]FIG. 8A is a front isometric view of a housing/shielding unitaccording to the second embodiment of the invention.

[0015]FIG. 8B is a front isometric view of an alternatehousing/shielding unit according to an alternate embodiment of theinvention.

[0016]FIG. 9A is a bottom isometric view of the housing/shielding unitaccording to the second embodiment of the invention.

[0017]FIG. 9B is a bottom rear isometric view of an alternatehousing/shielding unit according to an alternate embodiment of theinvention.

[0018]FIG. 10A is a top exploded view of the second embodiment of thefiber-optic module according to the invention.

[0019]FIG. 10B is a bottom exploded view of the second embodiment of thefiber-optic module according to the invention.

[0020]FIG. 11A is a side view of the second embodiment of thefiber-optic module of FIGS. 10A and 10B mounted within a host system.

[0021]FIG. 12A is a side view of the first embodiment of the fiber-opticmodule of FIG. 6 mounted within a host system.

[0022]FIG. 11B is a front view of the second embodiment of thefiber-optic module of FIGS. 10A and 10B mounted within a host system(panel 1110 of the host system shown in dashed lines).

[0023]FIG. 12B is a front view of the first embodiment of thefiber-optic module of FIG. 6 mounted within a host system (panel 1210 ofthe host system shown in dashed lines).

[0024]FIG. 13 is a perspective view of a host system incorporatingembodiments of the fiber-optic modules of the invention.

[0025]FIG. 14 illustrates a starting sheet of material for theembodiments of the housing/shielding unit.

[0026]FIG. 15A illustrates an unfolded flat pattern layout for anembodiment of the housing/shielding unit.

[0027]FIG. 15B illustrates fold and bend lines on the unfolded flatpattern layout of FIG. 15A.

[0028]FIG. 15C illustrates an unfolded flat pattern layout for anembodiment of the housing/shielding unit.

[0029]FIG. 15D illustrates fold and bend lines on the unfolded flatpattern layout of FIG. 15C.

[0030]FIG. 16A illustrates an unfolded flat pattern layout for anembodiment of the housing/shielding unit.

[0031]FIG. 16B illustrates fold and bend lines on the unfolded flatpattern layout of FIG. 16A.

[0032] FIGS. 17A-17C illustrate alternate methods of assembling ahousing/shielding unit with a module chassis frame to form a fiber-opticmodule.

[0033]FIG. 18A is a top plan view of a first embodiment of our newdesign for a one-piece shielded housing;

[0034]FIG. 18B is a right side elevational view thereof, the left sideelevational view being a mirror image;

[0035]FIG. 18C is a front elevational view thereof;

[0036]FIG. 18D is a rear elevational view thereof;

[0037]FIG. 18E is a bottom plan view thereof;

[0038]FIG. 18F is a top perspective view thereof;

[0039]FIG. 18G is a bottom perspective view thereof;

[0040]FIG. 19A is a top plan view of a second embodiment of our newdesign for a one-piece shielded housing;

[0041]FIG. 19B is a right side elevational view thereof, the left sideelevational view being a mirror image;

[0042]FIG. 19C is a front elevational view thereof;

[0043]FIG. 19D is a rear elevational view thereof;

[0044]FIG. 19E is a bottom plan view thereof;

[0045]FIG. 19F is a top perspective view thereof;

[0046]FIG. 19G is a bottom perspective view thereof;

[0047]FIG. 20A is a top plan view of a third embodiment of our newdesign for a one-piece shielded housing;

[0048]FIG. 20B is a right side elevational view thereof, the left sideelevational view being a mirror image;

[0049]FIG. 20C is a front elevational view thereof;

[0050]FIG. 20D is a rear elevational view thereof;

[0051]FIG. 20E is a bottom plan view thereof;

[0052]FIG. 20F is a top perspective view thereof; and

[0053]FIG. 20G is a bottom perspective view thereof.

[0054]FIG. 21A is a top plan view of a first embodiment of our newdesign of a patterned material layer for a one-piece shielded housing;

[0055]FIG. 21B is a front elevational view thereof, the rear elevationalview being a mirror image;

[0056]FIG. 21C is a bottom plan view thereof;

[0057]FIG. 21D is a right side elevational view thereof, the left sideelevational view being a mirror image;

[0058]FIG. 22A is a top plan view of a second embodiment of our newdesign of a patterned material layer for a one-piece shielded housing;

[0059]FIG. 22B is a front elevational view thereof, the rear elevationalview being a mirror image;

[0060]FIG. 22C is a bottom plan view thereof;

[0061]FIG. 22D is a right side elevational view thereof, the left sideelevational view being a mirror image; and

[0062]FIG. 23 is a top plan view of a third embodiment of our new designof a patterned material layer for a one-piece shielded housing, a bottomplan view being a mirror image and the patterned material layer being athin and flat sheet so that only the top plan view need be shown.

[0063]FIG. 24 is a top perspective view of a fiber optic module foranother embodiment of the invention.

[0064]FIG. 25 is a bottom perspective view of the fiber optic module ofFIG. 24.

[0065]FIG. 26A is a rear perspective view of the fiber optic module ofFIG. 24.

[0066]FIG. 26B is a top view of the fiber optic module of FIG. 24.

[0067]FIG. 27 is a side view of the fiber optic module of FIG. 24.

[0068]FIG. 28 is a front view of the fiber optic module of FIG. 24mounted against a faceplate, backplate, or bezel in a system.

[0069]FIG. 29 is a side view of the fiber optic module of FIG. 24mounted in a system.

[0070]FIG. 30 is a top view of the fiber optic module of FIG. 24 mountedin a system.

[0071]FIG. 31 is a top view of a pattern for a front portion of ashielded housing/cover of the fiber optic module of FIG. 24.

[0072]FIG. 32 is a top view of the pattern of FIG. 31 includingbend/fold lines.

[0073]FIG. 33 is a top perspective view of a fiber optic module foranother embodiment of the invention.

[0074]FIG. 34 is a side view of the fiber optic module of FIG. 33.

[0075]FIG. 35 is a top view of the fiber optic module of FIG. 33.

[0076]FIG. 36 is a front view of the fiber optic module of FIG. 33.

[0077]FIG. 37 is a side view of the fiber optic module of FIG. 33mounted in a system.

[0078]FIG. 38 is a top view of the fiber optic module of FIG. 33 mountedin a system.

[0079]FIG. 39 is a top view of a pattern for a front portion of ashielded housing/cover of the fiber optic module of FIG. 33.

[0080]FIG. 40 is a top view of the pattern of FIG. 39 includingbend/fold lines.

[0081] Like reference numbers and designations in the drawings indicatelike elements providing similar functionality.

DETAILED DESCRIPTION OF THE INVENTION

[0082] In the following detailed description of the invention, numerousspecific details are set forth in order to provide a thoroughunderstanding of the invention. However, it will be obvious to oneskilled in the art that the invention may be practiced without thesespecific details. In other instances well known methods, procedures,components, and circuits have not been described in detail so as not tounnecessarily obscure aspects of the invention.

[0083] The invention includes embodiments of fiber-optic modules andtheir methods of manufacture and assembly of component parts.Fiber-optic module generally refers to fiber-optic transmitter modules,fiber-optic receiver modules, and fiber-optic transceiver modules. Thevarious fiber-optic modules can also be referred to as opto-electronictransmitter, receiver or transceiver modules; and electro-optictransmitter, receiver or transceiver modules. The fiber-optic module ofthe invention is capable of reducing electromagnetic interference (EMI)from both the fiber-optic module and from the system that incorporatesthe fiber-optic module. In accordance with one embodiment of theinvention, a fiber-optic module comprises a module chassis frame and ahousing/shielding unit. The housing/shielding unit can be formed of onepiece in which case it can also be referred to as a one-piece integratedhousing/shielding unit, a one piece shielded housing, an EMI box orcontainer, or a single-piece shielded housing integrating a protectionfunction and a shielding function. The module chassis frame can also bereferred to as a chassis, a frame, or a support fixture. Thehousing/shielding unit functions both as a protective outer housing forthe fiber-optic module as well as an EMI suppression device and achassis grounding feature. The housing/shielding unit can protect andshield the optical, electrical, and optical-electrical components withina fiber-optic module. The housing/shielding unit can be formed out ofconductive materials such as a metal, a plated plastic, a conductiveplastic or other electrically conductive material. The module chassisframe can be formed of a nonconductive material such as a nonconductiveplastic. The module chassis frame can also be formed of a conductivematerial such as sheet metal, a plated plastic, or conductive plastic soas to provide EMI shielding as well. The module chassis frame is thecentral structural support to which components of the fiber-optic moduleattach. These components can include an opto-electronic transmitterand/or an opto-electronic receiver. In the case of a fiber-optictransceiver module, the fiber-optic module includes a transmitteroptical subassembly, a receiver optical subassembly and an electricalsubassembly. Each of the opto-electronic transmitter and theopto-electronic receiver has a header which is shielded by a hollowcylindrical shielding collar. The hollow cylindrical shielding collarprovides electromagnetic shielding as well. The opto-electronictransmitter may include a Vertical Cavity Surface Emitting Laser (VCSEL)or a conventional semiconductor laser mounted inside of the header.

[0084] The housing/shielding is a multi-sided conductive enclosure thancan be formed out of sheet metal, plated plastic, conductive plastic orother electrically conductive material. In one embodiment, sheet metalis etched or stamped to form the housing/shielding unit. Thehousing/shielding unit also includes a pair of flaps and a septum whichallow it to be spot-welded, soldered, glued or otherwise fastened afterit is attached to the module chassis frame. The housing/shielding unitforms an enclosure that surrounds the module chassis frame. Fingers ortabs extend from the housing/shielding unit to ground it to a bezel, afaceplate, backplate, or a wall of a housing of a host system. In oneembodiment, the fingers press against the bezel, backplate, faceplate orwall of the housing of the host system to seal electromagnetic radiationtherein. In another embodiment, the fingers press against an opening inthe bezel, the faceplate, backplate, or the wall of the housing of thehost system to seal electromagnetic radiation therein.

[0085] The grounding scheme for the fiber-optic module includes signalgrounding and chassis grounding. Two grounds are utilized for isolationto prevent currents induced in the chassis ground from affecting theintegrity of signal ground. Signal ground is provided through one ormore ground pins of a transceiver printed circuit board (PCB) next tothe signal pins. The one or more ground pins couple to ground traces ona printed circuit board of the host system. Chassis ground isestablished by coupling to an outer housing of the host system which iselectrically isolated from the signal ground.

[0086] The invention employs a housing/shielding unit that functionsboth as protective outer housing as well as an EMI shield or suppressiondevice. The housing/shielding unit is a multi-sided enclosure which canbe made from one piece or a single piece of sheet metal, plated plasticor other electrically conductive material having an opening at one endfor receiving a fiber-optic connector to couple to one or morefiber-optic cables.

[0087] Referring now to FIG. 1, an fiber-optic module 100 of theinvention is illustrated. In one embodiment, the fiber-optic module 100is a 1×9 fiber-optic transceiver module. In which case the fiber-opticmodule is a duplex-SC transceiver designed for use in Gigabit Ethernetapplications and is compliant with specifications for IEEE-802.3zGigabit Ethernet (1000Base-SX) and Class 1 Laser Safety regulations,operates with 50/125 micrometer and 62.5/125 micrometer multimodeoptical fibers, has an Industry Standard 1×9 Footprint with integralduplex SC connector and meets a mezzanine height standard of 9.8 mm.

[0088] The fiber-optic module 100 includes a one-piece or single-pieceintegrated housing/shielding unit 115 and a module chassis frame 120.The fiber-optic module 100 with the one-piece or single-piece integratedhousing/shielding unit 115 may also be referred to as a forward shieldconfiguration. The housing/shielding unit 115 functions both as ahousing and as an EMI shield. The housing/shielding unit 115 minimizesinternal electromagnetic radiation from radiating outward andinterfering with other electronic circuits and devices. It alsominimizes external electromagnetic radiation from radiating inward andinterfering with the operation of the fiber-optic module 100. It alsominimizes the system electromagnetic radiation from leaking out throughan opening in a bezel, a faceplate, backplate, of a host panel throughwhich the fiber-optic module is installed. The module chassis frame 120may be formed of a conductive material, such as a conductive plastic, toprovide EMI shielding and to support other components assembled thereto.

[0089] The housing/shielding unit 115 has a top side 116, a left side117, a right side 118, and a back side 119 illustrated in FIG. 1. A pairof tangs 114A and 114B are present in the back side 119 in order tocouple the back side 119 together with the left side 117 and the rightside 118 respectively. The left side 117 and the right side 118 eachhave a tang 114A and 114B bent into an opening of a respective flaps(not shown in FIG. 1).

[0090] The housing/shielding unit 115 has one or more fingers 112located near a nose 113 of the fiber-optic module 100 at the edges of afrontal opening 313. The one or more fingers can also be referred to astabs. The one or more fingers are similarly shaped having a body and atip which is round in one embodiment. The body of the fingers 112 arebent outward from the main surface in one embodiment. In an alternateembodiment the tips may be slightly bent from the body of the fingers.The fingers can be equally sized and equally spaced or have differentsizing and difference spacing between each. Fingers 112A are locatedalong an edge of top side 116 of the housing/shielding unit 115. Fingers112B are located along an edge of side 117 of the housing/shielding unit115. Fingers 112C are located along an edge of side 118 (not shown inFIG. 1) of the housing/shielding unit 115. Fingers 112D are locatedalong an edge of side 119 (not shown in FIG. 1) of the housing/shieldingunit 115. Fingers 112A, 112B, 112C and 112D are generally referred to asfingers 112. The fingers 112 have a forward curvature and are bentoutwardly and slightly backwards from a frontal opening in thehousing/shielding unit 115 as illustrated. The fingers 112 can be usedto ground the housing/shielding unit 115 by coupling to a bezel orface-plate which is grounded. The fingers 112 are illustrated as being aplurality of fingers but can be one or more fingers on any one or allsides.

[0091] Referring now to FIG. 2, the fiber-optic module 100 includes thehousing/shielding unit 115 and the module chassis frame 120. Thehousing/shielding unit further includes a septum (not shown in FIG. 2)and a nose strap 210. The septum and nose strap are folded back into thefrontal opening of the housing/shielding unit around the module chassisframe 120. Prior to folding the septum and nose strap back into thefrontal opening, the electrical, optical and electro-optical componentsare installed on the module chassis frame 120 which is then insertedinto the housing 115 in one embodiment, or in another embodiment, thehousing is folded around the module chassis frame 120. The nose strap210 and the septum hold the module chassis frame 120 in place within thehousing 115. The module chassis frame 120 includes one or more opticalconnector receptacles 211 with optical connector openings 212. In oneembodiment, the one or more optical connector receptacles 211 are SCoptical connector receptacles with the optical connector openings 212being SC optical connector openings.

[0092] Referring now to FIG. 3, a rear view of the housing/shieldingunit 115 is shown. The FIGS. 112A, 112B, 112C, and 112D are locatedalong the edge of the frontal opening 313 of the housing/shielding unit115 as shown. The housing/shielding unit 115 is a rectangular box madeof sheet metal, plated plastic or any other electrically conductivematerial. Except for a single side of the housing/shielding unit 115that is open so that the module chassis frame can be inserted into it,all other sides of the housing/shielding unit can be closed. Once themodule chassis frame 120 is inserted into the housing/shielding unit 115through the open side, it is closed to minimize electromagneticradiation from the fiber optic module.

[0093] Referring now to FIG. 4A, a bottom view of the housing/shieldingunit 115 is shown. The housing/shielding unit 115 has an open region 400in its bottom side. One or more fingers 112C are located along the edge419 of the housing/shielding unit 115. The fingers 112 curve outward andpoint more forward from surfaces of the housing/shielding unit. Thefingers 112 have spring-like resilience (i.e. spring loaded or flexible)and provide a mechanical and electrical contact between the fiber-opticmodule and a bezel, a face-plate or a wall (not shown in FIG. 4). Thus,the fingers 112 can also be referred to as spring fingers or forwardfingers. There are also a pair of flaps 402A and 402B and a septum 411on the bottom side of the housing/shielding unit 115. The septum 411 theflaps 402A-402B and 405A-405B of the housing/shielding unit can be spotwelded, soldered, glued, or otherwise fastened together. Thehousing/shielding unit 115 forms an enclosure that surrounds the modulechassis frame 120. Fingers 112A, 112B, 112C, and 112D can ground thehousing/shielding unit 115 to seal in electromagnetic radiation to avoidit affecting a host system, and to avoid the electromagnetic radiationof host system from leaking out through openings in the bezel,faceplate, or backplate.

[0094] Referring now to FIG. 4B, a bottom left side isometric view of analternate housing/shielding unit 115′ is shown. The housing/shieldingunit 115′ differs from housing/shielding unit 115 in the strap, leftside, right side, bottom side and the back side. The housing/shieldingunit 115′ is additionally longer so that the fingers 112 are nearer thefront of the optical connector openings 212. That is back side 119 isreplaced by back side 119′ with a retaining flap 429; left side flap 117is replaced by left side flaps 117A and 117B separated by a left sideslit 1511L; right side flap 118 is replaced by right side flaps 118A and118B separated by a right side slit 1511R; bottom side flaps 402A, 402B,405A and 405B are replaced by bottom side flaps 415A and 415B; strap 210is replaced by strap 210′, septum 411 is replaced by septum 411′, andopen region 400 is replaced by open region 400′. Otherwise, thehousing/shielding unit 115′ and the housing/shielding unit 115 havesimilar elements and features including the one or more fingers 112A,112B, 112C, and 112D.

[0095] The housing/shielding unit 115′ forms an enclosure that surroundsthe module chassis frame 120 or 120′. Fingers 112A, 112B, 112C, and 112Dcan ground the housing/shielding unit 115′ to seal internalelectromagnetic radiation therein to avoid it affecting a host systemand keep out external electromagnetic radiation to increase noiseimmunity of the electronic and opto-electronic components inside. Italso minimizes the electromagnetic radiation of the host system fromleaking out of openings in the bezel, faceplate, or backplate.

[0096] Referring now to FIG. 5A, the housing/shielding unit 115 and analternate module chassis frame 120′ are illustrated. The module chassisframe 120′ has a single pin opening 536 in its base 604′ through whichall pins 612 may extend but otherwise is similar to the module chassisframe 120. The module chassis frame 120′ includes the optical connectorreceptacles 211 at one end and a left wall 602L and a right wall 602Rcoupled to the base 604′ at an opposite end. The walls 6021 and 602Reach have a slot 634L and 634R respectively on their inside surfaces.The optical connector receptacles 211 have a rectangular opening or slot626 along the width of the module chassis frame 120′.

[0097] The housing/shielding unit 115 includes the front nose strap 210and the septum 411. The front nose strap 210 may be a metal or a plasticband used for fastening or clamping the module chassis frame 120 to thehousing/shielding unit 115. The front nose strap 210 can consists ofthree portions, a first extension portion 210A, a wrap portion 210B anda second extension portion 210C. The wrap portion 210B engages with theslot 638 of the module chassis frame 120 or 120′. The septum 411 canalso be welded or bonded to bottom flaps of the housing/shielding unit115 to hold the module chassis frame therein.

[0098] Referring now to FIG. 5B, the alternate housing/shielding unit115′ and the alternate module chassis frame 120′ are illustrated. Thehousing/shielding unit 115′ includes the front nose strap 210′ and theseptum 411′. The front nose strap 210′ may be a metal or a plastic strapused to fasten or clamp the module chassis frame 120 or 120′ to thehousing/shielding unit 115′. The front nose strap 210′ is a singleportion compared to the first extension portion 210A, wrap portion 210Band second extension portion 210C of the front nose strap 210. The nosestrap 210′ engages with the slot 638 of the module chassis frame 120 or120′. The septum 411′ can be welded or bonded to bottom flaps of thehousing/shielding unit 115′ to hold the module chassis frame therein.

[0099] Referring now to FIG. 6, an exploded view of the fiber-opticmodule 100 of the invention is illustrated. The fiber-optic module 100includes the integrated one-piece housing/shielding unit 115, the modulechassis frame 120, and other optical, electrical and opto-electroniccomponents. The module chassis frame 120 includes the optical connectorreceptacles 211 at one end and a left wall 602L and a right wall 602Rcoupled to a base 604 at an opposite end. The walls 6021 and 602R eachhave a slot 634L and 634R respectively on their inside surfaces. Theoptical connector receptacles 211 have a rectangular opening or slot 626along the width of the module chassis frame 120. The base 604 has one ormore pin openings 636.

[0100] The optical, electrical and opto-electronic components of thefiber-optic module 100 are assembled into the module chassis frame 120.The components include a printed circuit board (PCB) 610, a packagedtransmitter 620 for transmitting optical signals, a packaged receiver621 for receiving optical signals, a pair of shielding collars 622A and622B, a pair of SC connectors 650A and 650B, and a U-Plate 624. Theshielding collars 622A and 622B can be formed from rolled sheet metal, aplated plastic, a conductive plastic, or other conductive materialformed into a hollow cylinder.

[0101] In one embodiment, the transmitter 620 is an 850-nm VCSEL and thereceiver 621 an integrated GaAs PIN-preamplifier or PIN-diode.

[0102] The printed circuit board 610 includes one or more PCB signalpins 612, edge traces 614 on each side for straddle mounting thetransmitter 620 and the receiver 621, and integrated circuits 616 forprocessing signals between the signal pins 612 and the transmitter 620and the receiver 621. The integrated circuits 616 may use a five volt (5v), a three volt (3 v) or other common power supply voltage used inintegrated circuits and host systems. The PCB signal pins 612 caninclude a transmit ground pin for transmitter components and a receiveground pin for receiver components. In an alternate embodiment, a singleground pin for electronic components may be provided, isolated from anyshielding ground features for the fiber-optic module. The printedcircuit board (PCB) 610 may have a ground plane on its top or bottomsurfaces to couple to ground and further provide electromagneticshielding.

[0103] The module chassis frame 120 includes a rectangular opening orslot 626, a pair of mounting posts 632 extending from its base 604 nearleft and right sides, slots 634L and 634R on inner sides of the walls602L and 602R, one or more pin openings 636, and one or more opticalconnector receptacles 211 with one or more optical connector openings212. In one embodiment, the one or more optical connector openings 212is two and the optical connector openings are SC optical connectoropenings for a duplex SC optical connection. The one or more opticalconnector openings 212 is separated by a slot 638. The rectangularopening 626 receives the U-plate 624. The one or more pin openings 636receives the one or more PCB signal pins 612. The slots 634L and 634Rare press-fit slots and receive the sides of the printed circuit board610. The pair of mounting posts 632 allow the transceiver to bemechanically coupled to a printed circuit board or the like. Themounting posts 632 can also be connected to chassis ground but shouldnot be connected to signal ground.

[0104] The grounding scheme of the fiber-optic module can be dividedinto categories of signal grounding and chassis grounding. Theseparation of signal grounding from chassis grounding can keep currentsinduced in a chassis ground from affecting signal integrity. Signalground is through one or more ground pins of the PCB pins 612 coupledfrom the PCB 610 to a ground trace in a host printed circuit board. Thehousing/shielding unit 115 or 115′ is part of the chassis ground andelectrically isolated from the signal ground. The housing/shielding unit115 or 115′ couples to chassis ground of a host system through one ormore of the fingers. The one or more fingers couple to a host panel neara host panel opening through which the fiber-optic module may extend.The fingers surround the host panel opening and effectively reduce thesize of the opening through which radiated electromagnetic energy mayescape to seal the host panel opening through which the fiber-opticmodule may protrude. With the housing/shielding unit 115 or 115′ coupledto chassis ground, it acts as a plug to block EMI radiated emissionsfrom escaping. Additionally, the smaller the host panel opening, thegreater the shielding effectiveness as the host system begins toresemble a Faraday cage.

[0105] The packaged transmitter 620 may contain a VCSEL or aconventional semiconductor laser and is mounted inside the transmitterport 623A. The packaged receiver 621 may include a PIN diode that ismounted inside the receiver port 623B. In one embodiment, thetransmitter and receiver are each packaged into a TO package and may bereferred to as the Tx Header and Rx Header respectively. Each of thepackaged transmitter 620 and receiver 621 have one or more pins orterminals 619 which couple to the edge traces 614 on each side of theprinted circuit board 610 to straddle mount them.

[0106] The SC connectors 650A and 650B include a lens 651A and 651Bmounted inside ports 623A and 623B respectively. The ports can also bereferred to as TO-can receptacles, TO-can holders, lens holders, etc.Semiconductor lasers and/or PINs can be mounted into metal TO-cans,which are then aligned into the ports or receptacles. The ports orreceptacles have lenses between the fiber ferrules and the TO-cans. Notethat lasers and photodiodes are not required to be packaged in TO-cansand can be packaged in other ways to mate with various shaped ports orreceptacles. The ports and the packaging of the semiconductor lasersand/or PINs need only facilitate that light can be transmitted orreceived as the case may be. Each of the SC connectors 650A and 650Bfurther includes a pair of snap lock clips 652 each having a retainingprotrusion 653, ferrule barrels 654, support struts 656 in a frontportion. Each of the SC connectors 650A and 650B further includescircular recesses 657 between each of the headers 623A and 623B andtheir respective flanges 655 in a rear portion. Each of the circularrecesses 657 mates with the U-shaped openings 627 of the U-plate 624.

[0107] The transmitter package is assembled to the SC connector to formthe Transmitter Optical Subassembly (Tx OSA). This Transmitter OpticalSubassembly is then soldered onto the PCB 610. Prior to soldering theheader assemblies 623A and 623B, the pair of shielding collars 622A and622B are attached with solder to the rear of the ports 623A and 623B.The PCB 610 may be secured by two press-fit slots, one in each innerside of the module chassis frame 120. The U-plate 624 providesadditional EMI sealing by minimizing leakage through the front of themodule. The U-plate 624 also includes a flap 625 located at its topside. The U-plate 624 is electrically grounded to the housing/shieldingunit 115 by the flap 625 making physical contact with thehousing/shielding unit 115.

[0108] The optical, electro-optical, and the electronic components areassembled into the module chassis frame 120 or 120′ before thehousing/shielding unit 115 encloses it. The transmitter 620 and thereceiver 621 have their pins 619 coupled to the traces 614T and 614B ofthe printed circuit board 610. In one embodiment the pins 619 arestraddle mounted to the printed circuit board 610 with some pins 619coupled to the traces 614T on a top side of the PCB 610 and other pins619 coupled to the traces 614B on a bottom side of the PCB 610. That is,one or more pins mount to one or more traces on one side of the printedcircuit board and another one or more pins mount to one or more traceson an opposite side of the printed circuit board.

[0109] The shielding collars 622A and 622B are inserted over the ports623A and 623B of the connectors 650A and 650B respectively to provideEMI shielding. The TO packaged transmitter 620 and receiver 621 arecoupled into the ports 623B and 623A respectively. This forms theoptical subassembly which is then attached to the electrical componentsthat is in turn coupled into the module chassis frame 120. The frontportion of the connectors 650A and 650B are inserted into openings 212in the nose of the module chassis frame 120 so that the pairs of snaplock clips 652 of each are nearly flush. Next the U-plate 624 isinserted into opening 626 so that its U-openings 627 fit into thecircular recesses 657 of each respective connector 650A and 650B. TheU-plate 624 holds the subassembly of the optical and electricalcomponents coupled into the module chassis frame 120. Additionally, theU-plate 624 can couple to the shielding collars 622A and 622B and thehousing/shielding unit 115 or 115′. The flap 625 of the U-plate 624couples to the housing/shielding unit 115 or 115′ when the fiber-opticmodule is fully assembled. This can electrically connect the collars622A and 622B, the U-plate 624 and the housing/shielding unit 115 or115′ together if all are formed of conductive materials. Assuming theyare electrically connected, grounding the housing/shielding unit 115 or115′ to chassis ground of a host system can also couple chassis groundinto the U-plate 624 and the shielding collars 622A and 622B forelectromagnetic shielding externally as well as internally. The TO-canheaders of the receiver and transmitter are coupled to signal ground orthe respective receiver ground and transmitter ground.

[0110] After the subassembly of optical and electrical components arecoupled into the module chassis frame 120 or 120′, the housing/shieldingunit 115 or 115′ can then be assembled around it. Assembly of thehousing/shielding unit 115 or 115′ with the module chassis frame 120 or120′ can be performed in different ways.

[0111] The housing/shielding unit 115 or 115′ can be formed out of asingle sheet of material. It can then be folded around the modulechassis frame 120 or 120′ with the affixed subassembly of optical andelectrical components. Alternatively, the housing/shielding unit 115 or115′ can be pre-folded out of the single sheet of material but for oneopening at a front or rear end. The module chassis frame 120 or 120′with an affixed subassembly of optical and electrical components canthen be inserted into the opening at the front or rear end of thehousing/shielding unit 115 or 115′.

[0112] In one embodiment, the housing/shielding unit 115 has all sidespre-folded but for the back side 119. The back side 119 is left unfoldedso that the module chassis frame 120 can be inserted through a rearopening of the housing/shielding unit 115. In this case, a nose end ofthe module chassis frame 120 and the subassembly of optical andelectrical components affixed thereto is inserted through the rearopening in the back of the housing/shielding unit 115 with its nosefacing forward. After being completely inserted, the back side 119 isthen folded down to have the tangs 114A and 114B bent inward to matewith window openings of flaps coupled to each side 117 and 118 to finishassembly of the housing/shielding unit 115 around the module chassisframe 120.

[0113] In another embodiment, the housing/shielding unit 115 has allsides pre-folded but for the septum 411 and strap 210. The septum 411and strap 210 are left unfolded so that the module chassis frame 120 canbe inserted through a frontal opening of the housing/shielding unit 115.The septum 411 and strap 210 are then folded around the module chassisframe 120 to form the housing/shielding unit 115. In this case, a rearend of the module chassis frame 120 and the affixed subassembly ofoptical and electrical components is inserted through the frontalopening of the housing/shielding unit 115 so that the rear facesrearward. After being completely inserted, the septum 411 and strap 210are then folded down and around as illustrated in FIG. 5 to finishassembly of the housing/shielding unit 115 around the module chassisframe 120.

[0114] In yet another embodiment, all sides of the housing/shieldingunit 115 are folded around the module chassis frame 120 and its affixedcomponents. These methods of assembly are further described below withreference to FIGS. 14-17C.

[0115] After assembling the housing/shielding unit 115 around the modulechassis frame 120 and its affixed components, then the septum 411 iswelded, soldered, glued, or otherwise fastened to the pair of flaps 402Aand 402B as shown in FIG. 4.

[0116] Referring now to FIG. 7, an perspective view of ahousing/shielding unit 715 and the module chassis frame 120 for afiber-optic module 700 are illustrated. The housing/shielding unit 715is somewhat similar to the housing/shielding unit 115 but has slightlydifferent dimensions, a few different features and employed in differentmounting configurations. The housing/shielding unit 715 has one or morefingers 712 which are carved out of the surfaces near the perimeter 735of an open end 739. The one or more fingers can also be referred to astabs. The one or more fingers are similarly shaped having a body and atip which is round in one embodiment. The body of the fingers 712 isbent from the main surface while the tips may be slightly bent from thebody to horizontal with the surface. The fingers 712 have a backwardsorientation, originating at the front or nose of the fiber-optic module700. Thus, the one or more fingers 712 may also be referred to asbackward fingers and the fiber-optic module 700 with thehousing/shielding unit 715 may also be referred to as a fiber-opticmodule with a backward shield configuration.

[0117] The fingers 712 can be grouped into fingers 712A and fingers 712Clocated on a top 716 and a bottom 730 respectively of thehousing/shielding unit 715. Fingers 712B and 712D are located along theedges of the opening of the housing/shielding unit 715. Although FIG. 7illustrates six fingers 712A on a top side 716 and six fingers 712C on abottom side 730, two fingers 712B on a left side 717, and two fingers712D on a right side 718, one or more fingers 727 can provide a means ofgrounding the housing/shielding unit 715.

[0118] The housing/shielding unit 715 differs further from thehousing/shielding unit 115 in that it has a different nose strap 710.The strap 710 and the septum 711 function similarly to the strap 210′and the septum 411 of the housing/shielding unit 115′. Because thedimensions of the housing/shielding unit 715 are larger so that it canextend further forward through an opening, the strap 710 differssignificantly from the strap 210 of the housing/shielding unit 115.

[0119] Referring now to FIG. 8A, a front view of the housing/shieldingunit 715 is shown. In this embodiment, the housing/shielding unit 715generally has the shape of an oblong box having six sides. Front side738 has a frontal opening 739 where the module chassis frame 120 can beinserted. The front side 738 of the housing/shielding unit 715 includesthe septum 710 that is welded or bonded to the flaps 910A and 910B. Thenose strap 711 also located at the opening 739 is used for strapping thehousing/shielding unit to the module chassis frame 120.

[0120] Referring now to FIG. 9A, a bottom isometric view of thehousing/shielding unit is shown. Attached to the open end 911 is a frontstrap 710 shown in the folded down position. Also shown, are two bottomflaps 910A and 910B for welding or bonding to septum 711.

[0121] Referring now to FIG. 8B, a front view an alternate embodiment ofthe housing/shielding unit 715′ is shown. In this alternate embodiment,the housing/shielding unit 715′ generally has a similar shape to thehousing/shielding unit 715. The housing/shielding unit 715′ differs fromhousing/shielding unit 715 in the left side, right side, bottom side andthe back side. That is back side 719 is replaced by back side 719′ witha retaining flap 429; left side flap 717 is replaced by left side flaps717A and 717B separated by a left side slit 1611L; right side flap 718is replaced by right side flaps 718A and 718B separated by a right sideslit 1611R; and bottom side flaps 910A and 910B are replaced by bottomside flaps 910A′ and 910B′. Otherwise the housing/shielding unit 715′and the housing/shielding unit 715 have similar elements and featuresincluding the one or more fingers 712A, 712B, 712C, and 712D.

[0122] The housing/shielding unit 715′ forms an enclosure that surroundsa module chassis frame 120 or 120′. Fingers 712A, 712B, 712C, and 712Dcan ground the housing/shielding unit 715′ to seal in electromagneticradiation (EMI) to minimize affecting a host system.

[0123] Referring now to FIG. 9B, a bottom isometric view of thealternate housing/shielding unit 715′ is shown. Attached to the open end911 is a front strap 711 shown in the folded down position. Also shown,are two bottom flaps 910A′ and 910B′ for welding or bonding to septum710.

[0124] Referring now to FIGS. 10A and 10B, a top and bottom explodedview of the fiber-optic module 700 of the invention is shown. In oneembodiment, the fiber-optic module 700 is a 1×9 fiber-optic transceivermodule. In which case, the fiber-optic module transceiver complies withthe industry standard 1×9 footprint and meets the mezzanine heightrequirement of 9.8 mm.

[0125] The grounding scheme of the fiber-optic module can be dividedinto categories of signal grounding and chassis grounding. Theseparation of signal ground from chassis ground can keep currentsinduced in a chassis ground from affecting signal integrity. Signalground is through one or more ground pins of the PCB pins 612 coupledfrom the PCB 610 to a ground trace in a host printed circuit board. Thehousing/shielding unit 715 or 715′ is part of the chassis ground andelectrically isolated from the signal ground. The housing/shielding unit715 or 715′ couples to chassis ground of a host system through one ormore of the fingers 712. The one or more fingers 712 couple to a hostpanel near a host panel opening through which the fiber-optic module mayextend. The fingers 712 contact the host panel opening and effectivelyreduce the size of the opening through which radiated electromagneticenergy may escape to seal the host panel opening through which thefiber-optic module may protrude. With the housing/shielding unit 715 or715′ coupled to chassis ground, it acts as a plug to block EMI radiatedemissions from escaping. Additionally, the smaller the host panelopening, the greater the shielding effectiveness as the host systembegins to resemble a Faraday cage.

[0126] The fiber-optic module 700 of the invention includes ahousing/shielding unit 715 or 715′, and a module chassis frame 120 or120′. The optic, electronic, and opto-electronic components of thefiber-optic module are placed into the module chassis frame 120. Thesecomponents and their assembly were previously described with referenceto FIG. 6 and the fiber-optic module 100 and are not repeated again forbrevity. When the housing/shielding unit 715 or 715 is assembled aroundthe module chassis frame and the optic, electronic, and opto-electroniccomponents affixed thereto, it can couple to the flap 625 of the U-plate624 so that it an be electrically grounded to chassis ground.Additionally, the U-plate 624 can couple to the shielding collars 622Aand 622B. This can electrically connect the collars 622A and 622B, theU-plate 624 and the housing/shielding unit 715 or 715′ together if allare formed of conductive materials. Assuming they are electricallyconnected, grounding the housing/shielding unit 715 or 715′ to chassisground of a host system can also couple chassis ground into the U-plate624 and the shielding collars 622A and 622B for electromagneticshielding externally as well as internally.

[0127] After all the components have been attached to the module chassisframe 120 or 120′, the housing/shielding unit 715 or 715′ can then beassembled around it. Assembly of the housing/shielding unit 715 or 715′around the module chassis frame 120 can be performed in the same wayspreviously described for the housing/shielding unit 115 or 115′.

[0128] Referring now to FIGS. 11A and 11B, a magnified side view and amagnified frontal view of the fiber-optic module 700 within a hostsystem is illustrated. The fiber-optic module 700 includes a backwardshield which is provided by the one-piece or single-piece integratedhousing/shielding unit 715 or 715′. The fiber-optic module 700 with theone-piece or single-piece integrated housing/shielding unit 715 or 715′provides an extended mount as illustrated by its nose extending beyond abezel, faceplate, or backplate. The host system may be a hub, switch,bridge, server, personal computer, or other network or electronicequipment desiring to connect to a communication system using anfiber-optic module. The fiber-optic module 700 is coupled to a printedcircuit board 1130 within the host system. A bezel, faceplate, orbackplate 1110 of the host system has a transceiver opening 1112 throughwhich the nose of the fiber-optic module extends when its coupled to thehost system. The transceiver opening 1120 of the bezel 1110 is sized toappropriately mate with the fingers 712 of the fiber-optic module 700.The opening 1120 has an inner surface 1114 which mates with the fingers712 to make an electrical coupling. By making contact to the innersurface 1114, a backside surface of the bezel 1110 can be insulated toavoid shorting an electrical component that might make contact thereto.When the nose of the fiber-optic module is inserted into the opening1112 or the opening 1112 is threaded over the nose of the fiber-opticmodule 700, the fingers 712 compress towards the fiber-optic module whenmating with the inner surface 1114 and expand outward to form a tightmechanical fit and a reliable electrical connection. The expansion ofthe fingers 712 outward effectively make the opening 1120 smallerthrough which radiated electromagnetic energy might otherwise escape.The fingers 712 also deter the nose of the fiber-optic module 700 fromextending excessively out through the opening 1120 of the bezel 1110.With the bezel 1110 grounded by the chassis of the host system, thehousing/shielding unit 715 of the fiber-optic module can be grounded byone or more fingers 712 coupling to the inner surface 1114 of theopening 1120. Alternatively, the housing/shielding unit 715 of thetransceiver 700 can be grounded through a pin or other connectioncoupled to the PCB 1130 of the host system.

[0129] Referring now to FIGS. 12A and 12B, a magnified side view and amagnified frontal view of the fiber-optic module 100 within a hostsystem is illustrated. The host system may be a switch, bridge, aserver, personal computer, or other network or electronic equipmentdesiring to connect to a communication system using an fiber-opticmodule. The fiber-optic module 100 is coupled to a printed circuit board1130 within the host system. A bezel, faceplate, or backplate 1210 ofthe host system has a transceiver opening 1220 through which the nose ofthe fiber-optic module partially extends when coupled to the hostsystem. The fiber-optic module 100, a forward shield configuration withthe one-piece or single-piece integrated housing/shielding unit 115 or115′, provides a flush mount as illustrated by FIG. 12A. The transceiveropening 1220 of the bezel 1210 is sized appropriately to allow insertionof a fiber-optic connector into the fiber-optic module 100. The bezel,faceplate, or backplate 1210 of the host system has a backside surface1214 to which the fingers 112 can make an electrical and a mechanicalcoupling. Furthermore, the fingers 112 deter the EMI of both thefiber-optic module 100 and the host system board 1130 from extendingexcessively out through the transceiver opening 1212 of the bezel 1210.When the nose of the fiber-optic module is inserted into the opening1112 or the opening 1112 is threaded over the nose of the fiber-opticmodule 100, one or more of the fingers 112 couple to the back sidesurface 1214 around the opening 1212 of the bezel 1210. With the bezel1210 grounded by the chassis of the host system, the housing/shieldingunit 115 of the fiber-optic module 100 can be grounded by one or morefingers 112 coupling to the back side surface 1214 of the bezel 1210.Alternatively if the bezel is coupled to a chassis ground trace, thehousing/shielding unit 115 or 115′ of the fiber-optic module 100 can begrounded through a pin or other grounding feature that is coupled to achassis ground trace of the PCB 1130 of the host system commonly coupledto the bezel.

[0130] Referring now to FIG. 13, an exemplary host system 1300 isillustrated having the fiber-optic module 100 and the fiber-optic module700. The host system 1300 has a bezel, a faceplate or a host panel 1310with opening 1120 and opening 1220 for the fiber-optic module 700 andthe fiber-optic module 100 respectively. The fiber-optic module 700 iscoupled to host printed circuit board 1130. The fiber-optic module 100is coupled to host printed circuit board 1130′. The host printed circuitboards 1130 and 1130′ may include a ground plane on a top surface orbottom surface under the area of the fiber optic module 100 and 700 inorder to provide additional electromagnetic shielding. With openings1120 and 1220 being relatively small encompassed by thehousing/shielding unit 715 or 715′ of the fiber-optic module 700 and thehousing/shielding unit 115 or 115′ of the fiber-optic module 100respectively, the host system 1300 begins to resemble a Faraday cage.The housing/shielding unit 115, 115′, 715, 715′ effectively sealsopenings 1120 and 1220 in the host panel 1310 to deter electromagneticradiation from leaking into or out of the host system. The one or morefingers 112 of the housing/shielding unit 115 or 115′ can surround theopening 1220. The one or more fingers 112 of the housing/shielding unit115 or 115′ can expand into the opening 1120. With the housing/shieldingunit 115 or 115′ coupled to chassis ground, it acts as a plug to blockEMI radiated emissions from escaping.

[0131] Most equipment such as the host system 1300 utilizing high-speedfiber-optic modules are required to meet the requirements of: 1) the FCCin the United States; 2) the CENELEC EN55022 (CISPR 22) specification inEurope; and 3) the VCCI in Japan. The fiber-optic modules 100 and 700are designed to perform to these specified limits of EMI includingcomplying with FCC Class B limits. The fiber-optic modules 100 and 700are also designed to provide good noise immunity from externallygenerated radio-frequency electromagnetic fields. Key components in thefiber-optic modules 100 and 700 to achieve good electromagneticcompliance (EMC) for EMI and external noise immunity are the internalshields (shielding collars 622A and 622B and the U-Plate 624), and ametal or conductive housing/shielding unit 115, 115′, 715 or 715′ withfingers 112 or 712 respectively of the fiber-optic modules 100 and 700.

[0132] The fiber-optic modules 100 and 700 are further designed to meetClass 1 eye safety and comply with FDA 21CFR1040.10 and 1040.11 and theIEC 825-1.

[0133] Referring now to FIGS. 14-17C, methods of forming thehousing/shielding units 115′ and 715′ out of a sheet of a material layerand assembly with the module chassis frame 120 or 120′ is illustrated.

[0134] In FIG. 14, a starting sheet of a layer of material 1400 for thehousing/shielding units 115, 115′, 715 and 715′ is illustrated. Thesheet of material 1400 is a conductive material and can be a metal, aplated plastic, a conductive plastic or other known type of electricallyconductive material. A first step in the process is to stamp, etch orcut the patterns for the housing/shielding unit 115, 115′, 715 or 715′out of the sheet of material 1400.

[0135] Referring now to FIG. 15A, an unfolded flat pattern layout 1500for the housing/shielding unit 115′ is illustrated. The unfolded flatpattern layout 1500 is a patterned material layer for thehousing/shielding unit 115′ formed out of the starting sheet of thelayer of material 1400. In the unfolded flat pattern layout 1500, theforward fingers 112, tangs 114A and 114B, strap 210 and the septum 411′of the housing/shielding unit 115′ are easily discernable. A pair ofleft and right window openings 1522L and 1522R are also visible in theunfolded flat pattern layout 1500.

[0136] Referring now to FIG. 15B, fold/bend lines are illustrated on theunfolded flat pattern layout 1500 to form the housing/shielding unit115′. A slightly alternate pattern and alternate fold/bend lines can beutilized to form the housing/shielding unit 115. The fold/bend linesillustrated on the unfolded flat pattern layout 1500 make other featuresand components of the housing/shielding unit 115′ discernable. Thefold/bend lines illustrated in FIG. 15B include left flap and right flapfold lines 1502L and 1502R, a back flap fold line 1504, left and righttang fold lines 1505L and 1505R, a retaining flap fold line 1506, leftwing and right wing fold lines 1508L and 1508R, finger base bend line1512, left bottom flap and right bottom flap fold lines 1514L and 1514R,a strap fold line 1516, and a septum fold line 1517.

[0137] A left wing 1520L and a right wing 1520R include tang windowopenings 1522L and 1522R respectively. The tangs 114A and 114B mate withthe tang window openings 1522L and 1522R respectively to hold the leftwing and right wing coupled to the back side 119′ after folding. Theseptum 411′ is coupled to the right bottom flap 415A and the left bottomflap 415B with an adhesive or a weld to hold the housing/shielding unitand the module chassis frame assembled together.

[0138] The left wing fold line 1508L defines the left wing 1520L fromthe left side flap 117B. The right wing fold line 1508R defines theright wing 1520R from the right side flap 118B. The right side fold line1502R and the right side slit 1511R defines right flaps 118A and 118Bfrom the top side 116. The left side fold line 1502L and the left sideslit 1511L defines left flaps 117A and 117B from the top side 116. Theright bottom flap fold line 1514R defines the right bottom flap 415A.The left bottom flap fold line 1514L defines the left bottom flap 415B.The retaining flap fold line 1506 defines a retaining flap 429 coupledto the back side flap 119′.

[0139] The fold/bend lines illustrated on the unfolded flat patternlayout 1500 are folded and/or bent to form the housing/shielding unit115′ as illustrated in FIG. 4B. Generally, the folds along fold linesare made at nearly a ninety degree angle but for the fold lines of thetangs 114A and 114B and fingers. The fingers 112 may be first bent orlastly bent to curve outward along the bend lines 1512. The left flaps117A and 117B and the right flaps 118A and 118B may be the next to befolded or they may be the first to be folded along fold lines 1502L and1502R. The right bottom flap 415A and the left bottom flap 415B are nextfolded along the right bottom flap fold line 1514R and the left bottomflap fold line 1514L respectively. The next sequence of fold/bend stepscan depend upon the method of assembly of the fiber-optic moduleutilized.

[0140] In a first case, the front of the housing/shielding unit 115′ isassembled first. In this case, the septum 411′ is folded along fold line1517 and then the strap 210′ is folded along fold line 1516. This isfollowed by the left wing 1520L and the right wing 1520R being foldedalong the left wing fold line 1508L and the right wing fold line 1508Rrespectively; the back side flap 119′ being folded along the fold line1504; the tangs 114A and 114B being folded along fold lines 1505L and1505R respectively; and the retaining flap 429 being folded along theretaining flap fold line 1506.

[0141] In a second case, the rear of the housing/shielding unit 115′ isassembled first. In this case, the left wing 1520L and the right wing1520R are folded along the left wing fold line 1508L and the right wingfold line 1508R respectively; the back side flap 119′ is folded alongthe fold line 1504; the tangs 114A and 114B are folded along fold lines1505L and 1505R respectively; and the retaining flap 429 is folded alongthe retaining flap fold line 1506. This is followed by the septum 411′being folded along fold line 1517 and then the strap 210′ folded alongfold line 1516.

[0142] In yet another case for assembly of the fiber-optic module,either order of assembly in the first or second case can be utilized ormixed together. The one or more fingers 112 may alternately be bentoutward from a frontal opening the into their curved shape as a laststep in the folding/bending process.

[0143] A slightly alternate pattern of the layout 1500 with alternatefold/bend lines is utilized to fold and bend into shape to form thehousing/shielding unit 115 as illustrated in FIGS. 1-3, 4A, 5 and 12A.

[0144] Referring now to FIG. 15C, an unfolded flat pattern layout 1500′for the housing/shielding unit 115 is illustrated. The unfolded flatpattern layout 1500 is a patterned material layer for thehousing/shielding unit 115 formed out of the starting sheet of the layerof material 1400. In the unfolded flat pattern layout 1500′, the forwardfingers 112, tangs 114A and 114B, strap 210 and a septum 411 of thehousing/shielding unit 115 are easily discernable. The pair of left andright window openings 1522L and 1522R are also visible in the unfoldedflat pattern layout 1500′.

[0145] Referring now to FIG. 15D, fold/bend lines are illustrated on theunfolded flat pattern layout 1500′ to form the housing/shielding unit115. The fold/bend lines illustrated on the unfolded flat pattern layout1500′ make other features and components of the housing/shielding unit115 discernable. The fold/bend lines illustrated in FIG. 15D includeleft flap and right flap fold lines 1502L′ and 1502R′, a back flap foldline 1504, left and right tang fold lines 1505L and 1505R, left wing andright wing fold lines 1508L and 1508R, finger base bend line 1512, leftbottom flap and right bottom flap fold lines 1514L′ and 1514R′, a firststrap fold line 1516′, and a second strap fold line 1517′.

[0146] The fold bend lines of the unfolded flat pattern layout 1500′ aresimilar to the fold/bend lines of the unfolded flat pattern layout 1500but for left flap and right flap fold lines 1502L′ and 1502R′, leftbottom flap and right bottom flap fold lines 1514L′ and 1514R′, a firststrap fold line 1516′, and a second strap fold line 1517′.

[0147] The right side fold line 1502R′ defines the right flap 118 fromthe top side 116. The left side fold line 1502L′ defines left flap 117from the top side 116. The right bottom flap fold line 1514R′ definesthe right bottom flaps 402A and 405A. The left bottom flap fold line1514L′ defines the left bottom flaps 402B and 405B. The back fold line1504 defines the back side flap 119 from the top side 116.

[0148] The first strap fold line 1516′ and the second strap fold line1517′ define the first extension portion 210A, the wrap portion 210B andthe second extension portion 210C of the strap 210. The strap 210 isfolded along the first strap fold line 1516′ and the second strap foldline 1517′. The septum 411 can couple to the right bottom flaps 402A and405A and the left bottom flaps 402B and 405B with an adhesive or a weldto hold the housing/shielding unit and the module chassis frameassembled together.

[0149] The fold/bend lines illustrated on the unfolded flat patternlayout 1500′ are folded and/or bent to form the housing/shielding unit115 as illustrated in FIGS. 1, 2, 3, and 4A. Generally, the folds alongfold lines are made at nearly a ninety degree angle but for the foldlines of the tangs 114A and 114B and fingers 112. The fingers 112 may befirst bent or lastly bent to curve outward along the bend lines 1512.The left flap 117 and the right flap 118 may be the next to be folded orthey may be the first to be folded along fold lines 1502L′ and 1502R′.The right bottom flaps 402A and 405A and the left bottom flaps 402B and405B are next folded along the right bottom flap fold line 1514R′ andthe left bottom flap fold line 1514L′ respectively. The next sequence offold/bend steps can depend upon the method of assembly of thefiber-optic module utilized. These were previously described withreference to the unfolded flat pattern layout 1500 of FIG. 15B.

[0150] Referring now to FIG. 16A, the unfolded flat pattern layout 1600for the housing/shielding unit 715′ is illustrated. The unfolded flatpattern layout 1600 is a patterned material layer for thehousing/shielding unit 715′ formed out of the starting sheet of thelayer of material 1400. In the unfolded flat pattern layout 1600, thebackward fingers 712, tangs 114A and 114B, strap 710 and the septum 711of the housing/shielding unit 715′ are easily discernable. A pair ofleft and right window openings 1622L and 1622R are also visible in theunfolded flat pattern layout 1600.

[0151] Referring now to FIG. 16B, fold/bend lines are illustrated on theunfolded flat pattern layout 1600 to form the housing/shielding unit715′. A slightly alternate pattern and alternate fold/bend lines can beutilized to form the housing/shielding unit 715. The fold/bend linesillustrated on the unfolded flat pattern layout 1600 make other featuresof the housing/shielding unit 715′ discernable.

[0152] The fold/bend lines illustrated in FIG. 16B include left flap andright flap fold lines 1602L and 1602R, back flap fold line 1604, leftand right tang fold lines 1605L and 1605R, retaining flap fold line1606, left wing and right wing fold lines 1608L and 1608R, finger basebend line 1612B, finger tip bend line 1612T, left bottom flap and rightbottom flap fold lines 1614L and 1614R, strap fold line 1616, septumfold line 1617. Generally, the folds along fold lines are made at nearlya ninety degree angle but for the fold lines of the tangs 114A and 114Band fingers.

[0153] A left wing 1620L and a right wing 1620R include window openings1622L and 1622R respectively. The tangs 114A and 114B mate with thewindow openings 1622L and 1622R respectively to hold the left wing andright wing coupled to the back side 719′ after folding.

[0154] The left wing fold line 1608L defines the left wing 1620L fromthe left side flap 717B. The right wing fold line 1608R defines theright wing 1620R from the right side flap 718B. The right side fold line1602R and the right side slit 1611R defines right flaps 718A and 718Bfrom the top side 716. The left side fold line 1602L and the left sideslit 1611L defines left flaps 717A and 717B from the top side 716. Theright bottom flap fold line 1614R defines the right bottom flap 910A′.The left bottom flap fold line 1614L defines the left bottom flap 910B′.The retaining flap fold line 1606 defines a retaining flap 1626 coupledto the back side flap 719′.

[0155] The fold/bend lines illustrated on the unfolded flat patternlayout 1600 are respectively folded and/or bent to form thehousing/shielding unit 715′ as illustrated in FIGS. 8B and 9B. Thesequence of folding and bending of the fold lines in the unfolded flatpattern layout 1600 is similar to that of the unfolded flat patternlayout 1500 but for the fingers. The fingers 712 for thehousing/shielding unit 715′ or 715 are generally easier to push or pullout of the surface of the unfolded flat pattern layout 1600 first. Then,the sequence of folding and bending can proceed similarly for any of thethree methods of assembly previously described.

[0156] Referring now to FIGS. 17A-17C, methods of assembly of thehousing/shielding units 115 and 715 with the module chassis frame 120 isillustrated.

[0157] In FIG. 17A, the layout 1500 or 1600 are placed on top of themodule chassis frame 120. Folding and bending is then performed aroundthe module chassis frame 120 or 120′ along the fold lines and bend linesdescribed in FIGS. 15A-15B or 16A-16B respectively to form thehousing/shielding unit 115, 115′, 715 or 715′. The housing/shieldingunit 115, 115′, 715 or 715′ then surrounds the module chassis frame 120or 120′. The tangs 114A and 114B are then folded into the windowopenings 1522L and 1522R or 1622L and 1622R. This results in asubstantially complete fiber-optic module such as fiber-optic module 100illustrated in FIG. 1 for example.

[0158] In FIG. 17B, the layout 1500 or 1600 is first folded and bentalong the fold lines and bend lines described in FIGS. 15A-15B or16A-16B respectively but for fold lines 1516 and 1517 or 1616 and 1617.This leaves the front of the housing/shielding unit 115, 115′, 715 or715′ open without the strap 710 and the septum 711 being folded. Themodule chassis frame 120 or 120′ with the affixed components is insertedinto the frontal opening with its rear entering first. Then the strap210, 210′ or 710 and the septum 411 or 711 are then folded fold lines1516 and 1517 or 1616 and 1617 as described in FIGS. 15A-15B and FIGS.16A-16B to hold the module chassis frame 120 or 120′ within thehousing/shielding unit 115, 115′, 715 or 715′. After being folded, theseptum 411 or 711 is affixed in place by being welded by spot welding,soldered with a solder, glued with an adhesive or otherwise fastened toa pair of bottom flaps. This results in a substantially completefiber-optic module such as fiber-optic module 100 illustrated in FIG. 1for example.

[0159] In FIG. 17C, the layout 1500 or 1600 is first folded and bentalong the fold lines and bend lines described in FIGS. 15A-15B or16A-16B respectively but for fold lines 1504, 1505L, 1505R, 1506, 1508Land 1508R or 1604, 1605L, 1605R, 1606, 1608L and 1608R. After beingfolded, the septum 411 or 711 is affixed in place by glue or welding.This leaves the rear of the housing/shielding unit 115, 115′, 715 or715′ open without the back side flap 119′ or 719′ and the left and rightwings 1520L or 1620L and 1520L or 1620R being folded. The front end ofthe module chassis frame 120 or 120′ with the affixed components isinserted into the rear opening of the housing/shielding unit, nosefirst. The left and right wings 1620L and 1620R are then folded followedby back side flap 119′ or 719′ along fold lines 1504, 1506, 1508L and1508R or 1604, 1606, 1608L and 1608R as shown and described in 15A-15Bor 16A-16B respectively. The tangs 114A and 114B are then folded alongfold lines 1505L and 1505R or 1605L and 1605R into the openings 1522Land 1522R or 1622L and 1622R respectively. With the back side flap 119′or 719′ held in place, the housing/shielding unit 115, 115′, 715 or 715′is held around the module chassis frame 120 or 120′. This results in asubstantially complete fiber-optic module such as fiber-optic module 100illustrated in FIG. 1 for example.

[0160] Fingers of a housing/shielding unit can deter electromagneticradiation from leaking out of the opening by expanding and/orsurrounding one or more portions of the opening or expanding into hosttabs as will be illustrated below. In either case the fingers of thehousing/shielding unit can make a connection to ground for the shieldedhousing/cover.

[0161] Referring now to FIG. 24, a fiber optic module 2400 isillustrated for another embodiment of the invention. Fiber optic module2400 includes a shielded housing/cover 2415 as well as other elementspreviously described in reference to fiber optic modules 100, 100′, 700or 700′. The shielded housing/cover 2415 maybe an integrated one-piecehousing/cover or a two-piece housing/cover. In the case of a two-piecehousing/cover the shielded housing/cover includes a front-shieldedhousing/cover 2415A and rear shielded housing/cover 2415B. The rearshielded housing/cover 2415B overlaps a portion of the front-shieldedhousing/cover 2415A. Alternatively, the front shielded housing/cover2415A could overlap a portion of the rear housing/cover 2415B. The fiberoptic module 2400 provides forward fingers on the perimeter of the topand bottom of the nose and backward fingers in the sides near the noseand the perimeter of the shielded housing 2415. Shielded housing/cover2415 includes forward fingers 112A′ on the top side near the perimeter,forward fingers 112C′ on the bottom side near the perimeter, backwardfingers 712B′ in the left side, and backward fingers 712D′ in the rightside near the perimeter. The shielded housing 2415 includes a front topside 2416A, a rear top side 2416B, a front left side 2417A, a rear leftside 2417B, a backside 2419, a front right side 2418A, and a rear rightside 2418B. The shielded housing/cover 2415 also includes a strap 210′and a septum 411′.

[0162] Referring now to FIG. 25, a bottom perspective view of the fiberoptic module 2400 is illustrated. Fiber optic module 2400 includes thechassis/base 120 or 120′. The chassis or base 120 or 120′ includes ventopenings 633 on the bottom side thereof. The left side 2417B of theshielded housing/cover 2415 meets the backside 2419 of the shieldedhousing/cover 2415 at a corner which may use a tongue and groovecoupling 2430. The rear portion 2415B of the shielded housing/cover 2415can include a back edge wrap 2429B, a left edge wrap 2429L and a rightedge wrap 2429R. When assembled with chassis/base 120 or 120′, one ormore of the edge wraps can wrap around chassis/base 120 or 120′ tocouple them together. The front portion of the shielded housing/cover2415A includes a right side bottom flap 415A and a left side bottom flap415B. When assembled with chassis/base 120 or 120′ the right side bottomflap 415A and the left side bottom flap 415B of the shieldedhousing/cover can be formed around chassis/base 120 or 120′ to couplethem together. To hold the strap 210′ in place around the chassis/base120 or 120′, the septum 411′ can be overlapped by the left and rightside bottom flap 415A and 415B.

[0163] The forward fingers 112A′ and 112C′ and the backward fingers712B′ and 712D′ can be formed out of different shapes including roundfingertips, rectangular fingertips, or triangular fingertips. Thefingers maybe arched shaped or curved or bent in one or more places, inorder to provide spring pressure and expand outward to seal around anopening in an enclosure, faceplate, or bezel for input/outputconnections. As previously mentioned the shielded housing/cover 2415 canbe an integrated one piece or a two-piece design. Similarly the shieldedhousing 115, 115′, 715 and 715′ can be either an integrated one-piece ora two-piece shielding housing/cover having a front portion and a rearportion. In this manner, the same rear portion 2415B of the shieldedhousing/cover maybe used interchangeably with different front portions,such as the front portion 2415A of the shielded housing/cover 2415. Thatis, by simply changing the front portion of the shielded housing/cover,backward fingers maybe supplied on top, bottom, left and right sides orforward fingers maybe provided on left, right, top and bottom sides orany combination thereof. This allows flexible assembly of fiber opticmodules. The decision of the type of shielding for the fiber opticmodule can be postponed until the subassembly of the chassis iscompleted and the rear portion of the shielded housing is wrapped aroundit. The front portion of the shielded housing/cover beinginterchangeable, allows flexibility in manufacturing and meeting thedemands of customers.

[0164] Referring now to FIG. 26A, a rear perspective view of the fiberoptic module 2400 illustrates the forward fingers 112A′ having roundedtips while the backward fingers 712B′ have more of a triangular shapedtip.

[0165] Referring now to FIG. 26B, a top view of the fiber optic module2400 illustrate differences in the positions of the forward fingers112A′ and 112C′ and the backward fingers 712B′ and 712D′ in the frontportion 2415A of the shielded housing/cover 2415.

[0166] Referring now to FIG. 27, a side view of the fiber optic module2400 better illustrates different possible shapes for the forwardfingers. The forward fingers may be curved or bent in differing places.The front shielded housing/cover 2415A includes the forward fingers112A′ on a top side and the forward fingers 112C′ on a bottom side. Theforward fingers 112A′ are illustrated as being curved or arched shapedin FIG. 27. The forward fingers 112C′ are illustrated as being bent intwo places (i.e. bent shaped) in FIG. 27 but can take on a curved orarched shape or other bent configuration in order to make contact with aback side surface of a bezel, faceplate, or backplate. The forwardfingers 112A′ can take on a bent shape or other bending configuration inorder to make contact to a back side surface of a bezel, faceplate, orbackplate.

[0167] Referring now to FIG. 28, a front view of the fiber optic module2400 is illustrated mounted adjacent a bezel, faceplate, or backplate2810. The bezel, faceplate, or backplate 2810 includes an opening 2820to allow a fiber optic plug to be inserted into the fiber optic module2400. Duplex SC receptacles for duplex SC plugs, provided in oneembodiment, can be readily seen in the front view of the fiber opticmodule 2400 separated by the strap 210′.

[0168] To seal around the opening 2820, the forward fingers 112A′ and112C′ couple (i.e. press) against the backside surface of the bezel,faceplate, or backplate 2810 adjacent to the opening 2820 withoutcoupling into the opening 2820. That is, the forward fingers 112A′ and112C′ are not inserted into the opening 2820. The left and right sidebackward fingers 712B and 712B′ also do not couple into the opening 2820nor do they couple against the backside surface of the bezel, faceplate,or backplate 2810. Rather, the backside backward fingers 712B and 712B′couple to host tabs (not shown in FIG. 28). The host tabs can beintegrated or coupled to the bezel, faceplate, or backplate 2810.

[0169] Referring now to FIG. 29, a cutaway side view of the fiber opticmodule 2400 inserted into a host system 2900 is illustrated. The fiberoptic module 2400 couples to a host printed circuit board 1130 or 1130′.The top forward fingers 112A′ and the bottom forward fingers 112C′couple to a backside surface 2902 of the bezel, faceplate, or backplate2810 as illustrated in FIG. 29. The top forward fingers 112A′ and thebottom forward fingers 112C′ do not couple to an inside surface 2902 ofthe opening 2820. Neither do the backward fingers 712D′ couple into theopening 2820. As can be seen, the backward fingers 712D′ (as well as thebackward fingers 712B′) are offset from the opening 2820 and thebackside surface 2902 of the bezel, faceplate, or backplate 2810.

[0170] Referring now to FIG. 30, a topside view of the fiber opticmodule 2400 coupled into the host system 2900 is illustrated. As can beseen as viewed from the topside, the host system 2900 includes a leftside host tab 3010B and a right side host tab 3010A. The right sidebackward fingers 712D′ couple to an inside surface 3014A of the host tab3010A. The left side backward fingers 712B′ couple to an inside surface3014B of the host tab 3010B. The host tabs 3010A and 3010B extend alongthe sides of the front shielded housing/cover 2415A. The overlap mayprovide improved EMI performance in deterring electromagnetic radiationfrom leaking in and out of the opening 2820. The host tabs 3010A and3010B may additionally provide lateral support when optical plugs arepushed into and pulled out of for the fiber optic module 2400, while theprinted circuit board 1130 or 1130′ provides horizontal support. Thehost tabs 3010A and 3010B may be coupled to the backside 2902 of thebezel, faceplate, or backplate 2810. Alternatively, the host tabs 3010Aand 3010B may be integrally formed with the bezel, faceplate, orbackplate 2810 and extend backward from the backside 2902. The topforward fingers 112A′ and the bottom forward fingers 112C′ do not coupleto the host tabs 3010A and 3010B. Thus, the fiber optic module 2400 canhave its nose flush with the faceplate 2810.

[0171] Referring now to FIG. 31, an unfolded flat pattern layout of thefront portion 2415A (i.e., the front shielded housing/cover) of theshielded housing 2415 is illustrated. The rear shielded housing/cover2415B can be envisioned by slightly modifying FIG. 16B so that the slits1611L and 1611R cut through the top 716 to meet each other. The unfoldedflat pattern layout 2415A is a patterned material layer formed out ofthe starting sheet of the layer of material 1400. The front shieldedhousing/cover 2415A and the rear shielded housing/cover 2415B can bestamped, cut or etched out of a conductive material (i.e. a metal suchas stainless steel for example). As mentioned previously, the forwardfingers 112A′ and 112C′ and the backward fingers 712B′ and 712D′ can beformed out of different shapes including round fingertips, rectangularfingertips or triangular fingertips.

[0172] Referring now to FIG. 32, fold/bend lines are illustrated on theunfolded flat pattern layout of the front shielded housing/cover 2415A.The fold/bend lines illustrated on the unfolded flat pattern layout makeother features of the front shielded housing/cover 2415A discernable.

[0173] The fold/bend lines illustrated in FIG. 32 include left flap andright flap fold lines 3202L and 3202R, left bottom flap and right bottomflap fold lines 3214L and 3214R, the forward finger base bend line 1512,the backward finger base bend line 1612B, the finger tip bend line1612T, the strap fold line 1616, and the septum fold line 1617.Generally, the folds along fold lines are made at nearly a ninety degreeangle but for the bend lines of the fingers 112A′, 112C′, 712B′, and712D′.

[0174] The right bottom flap fold line 3214R defines the right bottomflap 415A. The left bottom flap fold line 3214L defines the left bottomflap 415B. The right side fold line 3202R and the right bottom flap foldline 3214R define the front right side 2418A. The left side fold line3202L and the left bottom flap fold line 3214L define the front leftside 2417A. The left flap and right flap fold lines 3202L and 3202Rdefine the front top side 2416A.

[0175] The fold/bend lines illustrated on the unfolded flat patternlayout of FIG. 32 are respectively folded and/or bent to form the frontshielding/cover 2415A as illustrated in FIGS. 24-30. The sequence offolding and bending of the fold lines in the unfolded flat patternlayout of the front shielded housing/cover 2415A is similar to that ofthe unfolded flat pattern layouts 1500 and 1600 but for the fingers. Thebackward fingers 712B′ and 712D′ can be first pushed or pulled out ofthe surface of the unfolded flat pattern layout. Then, the sequence offolding and bending can proceed on the front shielded housing/cover2415A.

[0176] As previously mentioned, the forward fingers 112A′ and 112C′ andthe backward fingers 712B′ and 712D′ may be arched shaped or curved orbent in one or more places, in order to provide spring pressure andexpand outward to seal around the opening 2820 and/or couple to the hosttabs 3010A and 3010B.

[0177] Referring now to FIG. 33, a rear perspective view of a fiberoptic module 3300 is illustrated for another embodiment of theinvention. Fiber optic module 3300 includes a shielded housing/cover3315 as well as other elements previously described in reference tofiber optic modules 100, 100′, 700, 700′ and 2400. The shieldedhousing/cover 3315 maybe an integrated one-piece housing/cover or atwo-piece housing/cover. In the case of a two-piece housing/cover theshielded housing/cover includes a front-shielded housing/cover 3315A andrear shielded housing/cover 3315B. The rear shielded housing/cover 3315Boverlaps a portion of the front-shielded housing/cover 3315A in oneembodiment. Alternatively, the front shielded housing/cover 3315A couldoverlap a portion of the rear housing/cover 3315B in another embodiment.The fiber optic module 3300 provides forward fingers on the perimeter ofthe left and right sides of the nose and backward fingers in the top andbottom near the nose and the perimeter of the shielded housing 3315. Inparticular, shielded housing/cover 3315 includes backward fingers 712A′in the top side near the perimeter, backward fingers 712C′ in the bottomside near the perimeter (not shown in FIG. 33), forward fingers 112B′ inthe left side, and forward fingers 112D′ in the right side near theperimeter. The shielded housing 3315 includes a front top side 3316A, arear top side 3316B, a front left side 3317A, a rear left side 3317B, abackside 3319, a front right side 3318A, and a rear right side 3318B.The shielded housing 3315 also includes a strap 210′ and a septum 411′as is shown in FIG. 25 of the shielded housing 2415.

[0178] Fiber optic module 3300 includes the chassis/base 120 or 120′ andthe optical, opto-electronic, and the electronic components assembledtherein. The chassis or base 120 or 120′ includes vent openings 633 onthe bottom side thereof. The left side 3317B of the shieldedhousing/cover 3315 meets the backside 3319 of the shielded housing/cover3315 at a corner which may use a tongue and groove coupling. The rearportion 3315B of the shielded housing/cover 3315 can include a back edgewrap, a left edge wrap and a right edge wrap. When assembled withchassis/base 120 or 120′ one or more of the edge wraps can wrap aroundchassis/base 120 or 120′ to hold them assembled together. The frontportion of the shielded housing/cover 3315A includes a right side bottomflap 415A and a left side bottom flap 415B. When assembled withchassis/base 120 or 120′ the right side bottom flap 415A and the leftside bottom flap 415B of the shielded housing/cover can be formed aroundchassis/base 120 or 120′ to hold them together. To hold the strap 210′in place around the chassis/base 120 or 120′, the septum 411′ can beoverlapped by the left and right side bottom flaps 415A and 415B.

[0179] The forward fingers 112B′ and 112D′ and the backward fingers712A′ and 712C′ can be formed out of different shapes including roundfingertips, rectangular fingertips or triangular fingertips. The fingersmaybe arched shaped or curved or bent in one or more places, in order toprovide spring pressure and expand outward to seal around an opening.The shielded housing/cover 3315 can be an integrated one piece or atwo-piece design. In this manner, the same rear portion 3315B of theshielded housing/cover maybe used interchangeably with different frontportions, such as the front portion 2415A of the shielded housing/cover2415. That is, by simply changing the front portion of the shieldedhousing/cover backward fingers maybe supplied on top, bottom, left andright sides or forward fingers maybe provided on left, right, top andbottom sides or any combination thereof. This allows flexible assemblyof fiber optic modules. The decision of the type of shielding for thefiber optic module can be postponed until the subassembly of the chassisis completed and the rear portion of the shielded housing is wrappedaround it. The front portion of the shielded housing/cover beinginterchangeable, allows flexibility in manufacturing and meeting thedemands of customers.

[0180] Referring now to FIG. 34, a side view of the fiber optic module3300 is illustrated. The front shielded housing/cover 3315A includes theforward fingers 112B′ extending from the left side, while the forwardfingers 112D′ extend from the right side. The forward fingers 112B′ canbe curved or arched shaped, bent in two places, or otherwise bent inanother manner (i.e. bent shaped) in order to make contact with a backside surface of a bezel, faceplate, or backplate.

[0181] Referring now to FIG. 35, a top view of the fiber optic module3300 illustrates differences in the positions of the forward fingers112B′ and 112D′ and the backward fingers 712A′ and 712C′ in the frontportion 3315A of the shielded housing/cover 3415. The forward fingers112B′ and 112D′ extend from the perimeter of the front portion 3315Awhile the backward fingers 712A′ and 712C′ are a distance away from theperimeter extending out of the surface of the front portion 3315A.

[0182] Referring now to FIG. 36, a front view of the fiber optic module3300 and the forward fingers 112B′ and 112D′ and the backward fingers712A′ and 712C′ is illustrated. A bezel, faceplate, or backplate couplesto the forward fingers while leaving an opening to allow one or morefiber optic plugs to be inserted into the fiber optic module 3300.Duplex SC receptacles for duplex SC plugs, used in one embodiment, canbe readily seen in the front view of the fiber optic module 3300separated by the strap 210′.

[0183] Referring now to FIG. 37, a cutaway side view of the fiber opticmodule 3300 inserted into a host system 3700 is illustrated. The fiberoptic module 3300 couples to a host printed circuit board 1130 or 1130′.The host system 3700 includes a faceplate or bezel 3710 which has anopening 3720 to allow fiber optic plugs to connect to the fiber opticmodule 3300. The host system 3700 includes host tabs 3730A and 3730A,separate and apart or integral with the faceplate or bezel 3710 that canbe grounded to chassis ground. The backward fingers 712A′ and 712C′ areoffset from the opening 3720 and a backside surface 3712 of the bezel,faceplate, or backplate 3710. The top backward fingers 712A′ of theshielded housing 3315 couple to an inside surface 3374A of the host tab3730A. The bottom backward fingers 712C′ couple to an inside surface3774B of the host tab 3730B.

[0184] The host tabs 3730A and 3730B extend along the top and bottom ofthe front shielded housing/cover 3315A. The overlap between the hosttabs and the front shielded housing/cover may provide improved EMIperformance in deterring electromagnetic radiation from leaking in andout of the opening 3720. The host tabs 3730A and 3730B may additionallyprovide horizontal support when optical plugs are pushed into and pulledout of the fiber optic module 2400 along with the printed circuit board1130 or 1130′. The host tabs 3730A and 3730B may be coupled to abackside 3712 of the bezel, faceplate, or backplate 3710. Alternatively,the host tabs 3730A and 3730B may be integrally formed with the bezel,faceplate, or backplate 3710 and extend backward from the backside 3712.The left side forward fingers 112B′ and the right side forward fingers112D′ do not couple to the host tabs 3730A and 3730B but the backside3172 of the faceplate 3710.

[0185] Referring now to FIG. 38, a cutaway topside view of the fiberoptic module 3300 coupled into the host system 3700 is illustrated. Toseal around the opening 3720, the forward fingers 112B′ and 112D′ couple(i.e. press) against the backside surface 3712 of the bezel, faceplate,or backplate 3710 adjacent to the opening 3720 without coupling into theopening 3720. That is, the forward fingers 112B′ and 112D′ are notinserted into the opening 3720. The top and bottom backward fingers712A′ and 712C′ also do not couple into the opening 3720 nor do theycouple against the backside surface 3712 of the bezel, faceplate, orbackplate 3710. Rather, the backward fingers 712A′ and 712C′ couple tothe host tabs 3730A and 3730B. Nor do the backward fingers 712A′ and712C′ and nor do the forward fingers 112B′ and 112D′, couple to aninside surface 3724 of the opening 3720. Thus, the fiber optic module3300 can have its nose flush with the faceplate 3710.

[0186] Referring now to FIG. 39, an unfolded flat pattern layout of thefront portion 3315A (i.e., the front shielded housing/cover) of theshielded housing 3315 is illustrated. The rear shielded housing/cover3315B can be envisioned by slightly modifying FIG. 16B so that the slits1611L and 1611R cut through the top 716 to meet each other.

[0187] The unfolded flat pattern layout 3315A is a patterned materiallayer formed out of the starting sheet of the layer of material 1400.The front shielded housing/cover 3315A and the rear shieldedhousing/cover 3315B can be stamped, cut or etched out of a conductivematerial (i.e. a metal such as stainless steel for example). The forwardfingers 112B′ and 112D′ and the backward fingers 712A′ and 712C′ can beformed out of different shapes including round fingertips, rectangularfingertips or triangular fingertips.

[0188] Referring now to FIG. 40, fold/bend lines are illustrated on theunfolded flat pattern layout of the front shielded housing/cover 3315A.The fold/bend lines illustrated on the unfolded flat pattern layout makeother features of the front shielded housing/cover 3315A discernable.

[0189] The fold/bend lines illustrated in FIG. 40 include left flap andright flap fold lines 4002L and 4002R, left bottom flap and right bottomflap fold lines 4014L and 4014R, the forward finger base bend line 1512,the backward finger base bend line 1612B, the finger tip bend line1612T, the strap fold line 1616, and the septum fold line 1617.Generally, the folds along fold lines are made at nearly a ninety degreeangle but for the bend lines of the fingers 112B′, 112D′, 712A′, and712C′.

[0190] The right bottom flap fold line 4014R defines the right bottomflap 415A. The left bottom flap fold line 4014L defines the left bottomflap 415B. The right side fold line 4002R and the right bottom flap foldline 4014R define the front right side 3318A. The left side fold line4002L and the left bottom flap fold line 4014L define the front leftside 3317A. The left flap and right flap fold lines 4002L and 4002Rdefine the front top side 3316A.

[0191] The fold/bend lines illustrated on the unfolded flat patternlayout of FIG. 40 are respectively folded and/or bent to form the frontshielding/cover 3315A as illustrated in FIGS. 33-38. The sequence offolding and bending of the fold lines in the unfolded flat patternlayout of the front shielded housing/cover 3315A is similar to that ofthe unfolded flat pattern layouts 1500 and 1600 but for the fingers. Thefingers 712A′ and 712C′ can be first pushed or pulled out of the surfaceof the unfolded flat pattern layout. Then, the sequence of folding andbending can proceed on the front shielded housing/cover 3315A.

[0192] The forward fingers 112B′ and 112D′ and the backward fingers712A′ and 712C′ maybe arched shaped or curved or bent in one or moreplaces, in order to provide spring pressure and expand outward to sealaround the opening 3720 and/or couple to the host tabs 3730A and 3730B.

[0193] The invention has a number of advantages over the prior art whichwill become clear after thoroughly reading this disclosure.

[0194] The preferred embodiments of the invention are thus described.While the invention has been described in particular embodiments, theinvention should not be construed as limited by such embodiments. Forexample, the fiber-optic modules have been described as having one ormore pairs of a transmitter and a receiver for a fiber-optic transceivermodule. However, the fiber-optic modules may also have one or moretransmitters only or one or more receivers only for a fiber-optictransmitter module or a fiber-optic receiver module. Rather, theinvention should be construed according to the claims that follow below.

What is claimed is: 1-36. (Cancelled)
 37. (Unamended) A method forassembling a fiber optic module comprising: assembling optical,electrical and optical-electrical components into a chassis to form afirst subassembly; forming a back portion of a shielded housing aroundthe first subassembly to form a second subassembly; storing the secondsubassembly in inventory waiting for customer orders; and if a customerorder is received, forming a front portion of the shielded housingaround the second subassembly in response thereto.
 38. (Unamended) Themethod of claim 37 wherein, the front portion of the shielding housingincludes one or more forward fingers.
 39. (Unamended) The method ofclaim 37 wherein, the front portion of the shielding housing includesone or more backward fingers.
 40. (Unamended) The method of claim 37wherein, the front portion of the shielding housing includes one or moreforward fingers and one or more backward fingers.
 41. (Unamended) Themethod of claim 40 wherein, the forming of the front portion around thesecond subassembly includes folding a left side wing and a right sidewing.
 42. (Unamended) The method of claim 41 wherein, the forming of thefront portion around the second subassembly further includes folding astrap and a septum, the strap folded across an open end to strap theshielded housing onto the second subassembly, the septum folded into theopen end to couple to a bottom side of the shielded housing. 43.(Unamended) The method of claim 37 wherein, the forming of the frontportion of the shielded housing around the second subassembly furtherincludes forming a pattern of the front portion of the shielded housinginto a sheet of conductive material, the pattern including the one ormore fingers near an edge, folding the sheet of conductive materialalong a plurality fold lines, and bending the one or more fingers intoshape.
 44. (Unamended) A fiber optic module formed by the method ofclaim
 37. 45-79. (Cancelled)
 80. (New) The method of claim 37 wherein,if a customer order is not received, then continue the storing of thesecond subassembly in inventory waiting for customer orders.
 81. (New) Amethod of assembling a fiber optic module, the method comprising:assembling optical, electronic, and opto-electronic components into achassis to form a first subassembly, the optical, electronic, andopto-electronic components to process optical and electrical signals;forming a back portion of a shielded housing around the firstsubassembly to form a second subassembly; storing the second subassemblyin inventory waiting for customer orders; forming a front portion of theshielded housing; storing the front portion of the shielded housing ininventory waiting for customer orders; receiving a customer order; andassembling the front portion of the shielded housing around the secondsubassembly to form the fiber optic module responsive to the receivingof the customer order.
 82. (New) The method of claim 81 wherein, thefront portion of the shielding housing includes one or more forwardfingers.
 83. (New) The method of claim 81 wherein, the front portion ofthe shielding housing includes one or more backward fingers.
 84. (New)The method of claim 81 wherein, the front portion of the shieldinghousing includes one or more forward fingers and one or more backwardfingers.
 85. (New) The method of claim 81 wherein, the forming of thefront portion of the shielded housing includes forming a pattern of thefront portion of the shielded housing into a sheet of conductivematerial to generate a patterned sheet of conductive material, thepatterned sheet of conductive material including one or more fingersnear an edge.
 86. (New) The method of claim 81 wherein, the forming ofthe front portion of the shielded housing includes forming a pattern ofthe front portion of the shielded housing into a sheet of conductivematerial to generate a patterned sheet of conductive material, thepatterned sheet of conductive material including one or more fingersnear an edge, folding the patterned sheet of conductive material along aplurality of fold lines of the pattern, and bending the one or morefingers into shape.
 87. (New) A method of assembling a fiber opticmodule, the method comprising: assembling optical, electronic, andopto-electronic components into a chassis, the optical, electronic, andopto-electronic components to process optical and electrical signals;forming a first flat pattern of a back portion of the shielded housingfrom a sheet of conductive material; placing the first flat pattern ofthe back portion of the shielded housing onto the chassis; folding andbending the first flat pattern of the back portion of the shieldedhousing around the chassis to form a subassembly; storing thesubassembly in inventory waiting for customer orders; and in response toreceiving a customer order, assembling the front portion of the shieldedhousing around the subassembly to form the fiber optic module.
 88. (New)The method of claim 87 further comprising: prior to the assembling ofthe front portion of the shielded housing around the subassembly,forming the front portion of the shielded housing; and storing the frontportion of the shielded housing in inventory waiting for the customerorders.
 89. (New) The method of claim 88 wherein, the forming of thefront portion of the shielded housing includes forming a pattern of thefront portion of the shielded housing into a sheet of conductivematerial to generate a patterned sheet of conductive material, thepatterned sheet of conductive material including one or more fingersnear an edge.
 90. (New) The method of claim 88 wherein, the forming ofthe front portion of the shielded housing includes forming a pattern ofthe front portion of the shielded housing into a sheet of conductivematerial to generate a patterned sheet of conductive material, thepatterned sheet of conductive material including one or more fingersnear an edge, folding the patterned sheet of conductive material along aplurality of fold lines of the pattern, and bending the one or morefingers into shape.
 91. (New) The method of claim 87 further comprising:prior to the storing the subassembly in inventory waiting for customerorders, placing shielding collars around the opto-electronic components;and inserting a U-plate into an opening in the chassis to electricallyconnect the U-plate to the shielding collars around the opto-electroniccomponents, the U-plate including a flap to electrically connect to theback portion of the shielded housing.
 92. (New) The method of claim 91wherein, the front portion of the shielded housing overlaps the backportion of the shielded housing to electrically connect together thefront portion of the shielded housing, the back portion of the shieldedhousing, the U-plate, and the shielding collars.
 93. (New) The method ofclaim 87 wherein, the front portion of the shielded housing overlaps theback portion of the shielded housing to electrically connect themtogether.
 94. (New) The method of claim 87 wherein, the front portion ofthe shielding housing includes one or more forward fingers.
 95. (New)The method of claim 87 wherein, the front portion of the shieldedhousing includes one or more backward fingers.
 96. (New) The method ofclaim 87 wherein, the front portion of the shielded housing includes oneor more forward fingers and one or more backward fingers.
 97. (New) Themethod of claim 87 wherein, the back portion of the shielded housing toprotect the optical, electronic, and opto-electronic components whilethe subassembly is stored in inventory.
 98. (New) The method of claim 87wherein, the back portion of the shielded housing to protect and shieldelectromagnetic radiation away from the at least one electricalcomponent, the front portion of the shielded housing to shield externalcomponents from electromagnetic radiation generated by the at least oneopto-electronic device, and the front portion of the shielded housing toshield the at least one opto-electronic device from electromagneticradiation generated by the external components.